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10+ years experience, MS, PhD in MEMS
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Must have knowledge for MEMS Silicon processing – Deep Si Etch, Thick Films, New materials, Wafer Bonding, Oxide and Si release processing
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Wafer Bonder expertise using a variety of materials used in the industry
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Able to lead a team of process engineers to develop novel and industry standard MEMS processes
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Should be able to define and process flow with customers for new and novel MEMS technology
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Hands on approach with process engineering and transparent substrate handling and processing
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Fundamental understanding of MEMS device requirements and MEMS integration designs
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Must be able to communicate with customers, and develop and present technical marketing presentations
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Process know how for Fabrication of MEMS devices
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Must be able to conduct Design of Experiments Methodology
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Must be able to work with customers on novel material integration and develop solutions for process integration
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Knowledgeable in litho, films, etch, metals, and wafer bonding, thick Oxide/SiN with low stress, Polyimide, Anti-stiction, Cleans, etc.
- Communicate and work with customers on new solutions for MEMS applications