Sr. MEMS Bonding Engineer

Austin, TX

Req# 1032

Direct Hire

Job Description

This position will implement technology integration know how for Micro Electrical Mechanical Systems (MEMS) applications i.e. accelerometers, gyros, print heads, pressure sensors, etc. and will define process flow based on customer requirements.  Also responsible for design and execution of statistically designed experiments.

Responsibilities

• Implement wafer bonder solutions for a wide variety of materials.
• Use IR and acoustic techniques to evaluate bond quality.
• Assist in the development of new and novel MEMS technologies.
• Work with customers on novel material integration and develop solutions.
• Develop and communicate/present technical material.

 

Requirements

• 10+ years experience, MS, PhD in Engineering, Chemistry, Physics or Material Science.
• Good customer interaction skills.
• In depth understanding and experience in wafer bonding processes. 
• Hands-on experience developing wafer bonding processes and other process modules. 
• Knowledgeable in litho, films, etch, and metals.
• Experience in Si etch processing.
• Experience in wet processing for MEMS applications.

 

Notice to Search Firms and Staffing Agencies
SVTC maintains an approved supplier list based on current skill set and technology requirements.
Therefore, our supplier base is limited to our specific hiring needs in a given business cycle.
SVTC does not accept resumes from unapproved suppliers. Any resumes received from unapproved
suppliers will be considered unsolicited and SVTC will not be obligated to pay a referral fee.