Job Description

This position will implement technology integration know how for Micro Electrical Mechanical Systems (MEMS) applications i.e. accelerometers, gyros, print heads, pressure sensors, RF, Speakers, Microphones, etc. and will define process flow based on customer requirements. Also responsible for design and execution of statistically designed experiments, and providing expertise and project management to provide solutions to customer challenges.

• From time to time, will lead a team of process engineers in development of new and novel MEMS technologies.  
• Work with customers on novel material integration and develop solutions for process integration.
• Implement wafers bonder solutions for a wide variety of materials.

Basic Qualifications

• At minimum, a MS Degree in Engineering with a minimum of 5 years experience in semi-conductor manufacturing and/or R&D environment, responsible for such tasks as outlined above
• Must have knowledge for MEMS Silicon processing – Deep Si Etch, Thick Films, New materials, Bonding, low stress films and Si release processing
• Wafer Bonder expertise using a variety of  materials used in the industry
• Capable of leading a team of process engineers to develop novel and industry standard MEMS processes
• Technology integration know-how for MEMS applications i.e. Accelerometers, Gyros, Print heads, Pressure Sensors, RF, Speakers, Microphones, etc.
• Capable of defining process flow with customers for new and novel MEMS technology
• Hands on approach with process engineering and transparent substrate handling and processing
• Fundamental understanding of MEMS Device requirements and MEMS integration Designs
• Must be able to communicate with enabling customers and technical marketing presentations
• Process know how for Fabrication of MEMS devices
• Must be able to conduct Design of Experiments MethodologyMust be able to work with customers on novel material integration and develop solutions for process integration
• Knowledgeable in litho, films, etch, metals, and wafer bonding, thick Oxide/SiN with low stress, Polyimide, Anti-stiction, Cleans, etc.
• Communicate and work with customers on new solutions for MEMS applicationsFundamental understanding of semiconductor devices and process integration issues
• Ability to design and perform DOE's for process development and process optimization
• Working knowledge of SPC and its use in process control
• Strong technical and problem solving skills

• Must be fluent in written and verbal English
• Visa sponsorship is not available for this position

*Notice to Search Firms and Staffing Agencies
SVTC maintains an approved supplier list based on current skill set and technology requirements.
Therefore, our supplier base is limited to our specific hiring needs in a given business cycle.
SVTC does not accept resumes from unapproved suppliers. Any resumes received from unapproved
suppliers will be considered unsolicited and SVTC will not be obligated to pay a referral fee.